Sierra Wireless’s thinnest ever 4G LTE module


Sierra Wireless has introduced the first ever ultra-thin 4G LTE module, the AirPrime EM7700, and in this way the company has done one of the best jobs in giving the 4G service while considering the size.

[hana-code-insert name=’StumbleUpon’ /][hana-code-insert name=’Reddit’ /]The EM7700 comes with dimensions of 50 x 30 and 2.5 millimeters thickness, and uses the Qualcomm MDM9200 Gobi chipset. It is designed to support Windows 8 and is considered to be the best option for tablets and ultra-portable notebooks as it is compatible with Qualcomm’s API and the USB-IF mobile Broadband Interface Model (MBIM) for easy integration by PC OEMs.

This wireless module also supports HSPA+ and 3G technologies for those areas where LTE is not still available. It can operate at a temperature range from -20 degrees to +60 degrees C.

The company has designed the AirPrime EM7700 especially for AT&T 4G LTE network and it is based on AirPrime MC7700 module, which was certified by AT&T last year.

“Demand for smaller, thinner devices has continued to grow, and at the same time, we have become accustomed to being able to connect tohigh-speed networks from our gadgets anytime and anywhere,” said Dan Schieler, Senior Vice President, Mobile Computing for Sierra Wireless. “The AirPrime EM7700 module offers an innovative, much-needed solution for OEMs building 4G connectivity into ultra-thin devices, and we look forward to working with our customers to bring it to market in exciting new products.”

Source: Sierra Wireless

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