This research has been published online in the journal Nature.
Researchers are of the opinion that 3D microchip will have more storage capacity by allowing information to be spread across several layers instead of one layer as in the case of traditional chips.
Back in May, 2011, Intel claimed that it has made the new 3D dimensional transistor design. The invention was considered as the most significant in the last 60 years. The company uses miniscule fins attaching to the surface of the flat transistors.
The same year in September IBM and 3M joined hands to develop 3D microchips.
Then in February 2012, scientists from MIT designed Microelectromechanical systems (MEMS) silicon based device with 3D sensing capabilities.
And now, there is another innovative news of 3D microchips. Read More …