Scientists have successfully developed a 3D microchip that has the ability to move information not only from left to right or front to back but also up and down.
This research has been published online in the journal Nature.
Researchers are of the opinion that 3D microchip will have more storage capacity by allowing information to be spread across several layers instead of one layer as in the case of traditional chips.
Back in May, 2011, Intel claimed that it has made the new 3D dimensional transistor design. The invention was considered as the most significant in the last 60 years. The company uses miniscule fins attaching to the surface of the flat transistors.
The same year in September IBM and 3M joined hands to develop 3D microchips.
Then in February 2012, scientists from MIT designed Microelectromechanical systems (MEMS) silicon based device with 3D sensing capabilities.
And now, there is another innovative news of 3D microchips. Continue reading
IBM is fully confident about the invention of digital devices that would be able to see, hear, taste, smell and touch in 5 years as shown by the company’s “5 in 5” list representing the five trends in the next five years.
Instead of brain, the new era of digital devices would rely on “cognitive computing” that would enable the computers and other devices to learn from experience rather than depending on programming so that the device will automatically check for the right option and if there is not a better option the computer will try to generate the best one after checking its history.
“That’s a foundationally different way of thinking of computing,” Bernie Meyerson, IBM’s vice president of innovation, told in an interview to Mashable. “You have to change how you think about absorbing data. You can’t just take a picture and file the picture. You have to treat the picture as an entity at a very high level, as opposed to just a bunch o’ bits.”
“[Cognitive computing] makes for some very interesting shifts in capability,” he adds. “That’s a rather profound sort of driver.” Continue reading
IBM has announced a technology that is said to be a “breakthrough optical communication technology” through which the company has utilized the light instead of electrical signals to send out information from one place to another. This technology has been announced by the company in San Francisco and it is called as “silicon nanophotonics”.
This progress forms a part of IBM’s “Exascale computing program,” which aims to develop a supercomputer that can make a million trillion calculations (a so-called “Exaflop”) per second.
In this technology, IBM has utilized single silicon chip that is made by using standard 90 nanometer manufacturing process and has integrated both the optical components and electrical circuits. This chip has the ability to transmit 25 Gigabits of optical data per second.
Companies rely on each other. One company gives products and services, the other company takes those services. This second company in turn gives products and services, which some other company takes and uses. After searching, you may find that the large companies stand on the shoulders of the other big or small companies. Continue reading
IBM has started a new pilot project in collaboration with Honda Motor Co., Inc. and Pacific Gas and Electric Company (PG&E). This project will allow communication between the electric vehicles (EVs) and the power grid. Continue reading