Scientists have successfully developed a 3D microchip that has the ability to move information not only from left to right or front to back but also up and down.
This research has been published online in the journal Nature.
Researchers are of the opinion that 3D microchip will have more storage capacity by allowing information to be spread across several layers instead of one layer as in the case of traditional chips.
Back in May, 2011, Intel claimed that it has made the new 3D dimensional transistor design. The invention was considered as the most significant in the last 60 years. The company uses miniscule fins attaching to the surface of the flat transistors.
The same year in September IBM and 3M joined hands to develop 3D microchips.
Then in February 2012, scientists from MIT designed Microelectromechanical systems (MEMS) silicon based device with 3D sensing capabilities.
IBM is fully confident about the invention of digital devices that would be able to see, hear, taste, smell and touch in 5 years as shown by the company’s “5 in 5” list representing the five trends in the next five years.
Instead of brain, the new era of digital devices would rely on “cognitive computing” that would enable the computers and other devices to learn from experience rather than depending on programming so that the device will automatically check for the right option and if there is not a better option the computer will try to generate the best one after checking its history.
“That’s a foundationally different way of thinking of computing,” Bernie Meyerson, IBM’s vice president of innovation,told in an interview to Mashable. “You have to change how you think about absorbing data. You can’t just take a picture and file the picture. You have to treat the picture as an entity at a very high level, as opposed to just a bunch o’ bits.”
IBM has announced a technology that is said to be a “breakthrough optical communication technology” through which the company has utilized the light instead of electrical signals to send out information from one place to another. This technology has been announced by the company in San Francisco and it is called as “silicon nanophotonics”.
This progress forms a part of IBM’s “Exascale computing program,” which aims to develop a supercomputer that can make a million trillion calculations (a so-called “Exaflop”) per second.
In this technology, IBM has utilized single silicon chip that is made by using standard 90 nanometer manufacturing process and has integrated both the optical components and electrical circuits. This chip has the ability to transmit 25 Gigabits of optical data per second.
The technology giant International Business Machines Corp. (IBM) has been agreed to acquire Burlington’s Emptoris Inc., a provider of cloud analytics software that helps companies in making supply-chain operations more efficient, in another bid to fill out its mounting catalog of business-to-business and business-to-consumer business. It is the 20th acquisition of the Massachusetts’s company since 2003.
The acquisition started in March 2011. Terms were undisclosed.
IBMand Micron Technology has announced the production of novel memory cubes i.e. hybrid memory cube (HMC) device with the first commercial CMOS manufacturing technology to make use of through-silicon vias (TSVs) i.e. IBM’s 3D chip-making process.