3D microchip for efficient working of technological devices

New microchip helps to take information in three dimensions (Credit: LindenArtWork)Scientists have successfully developed a 3D microchip that has the ability to move information not only from left to right or front to back but also up and down.

This research has been published online in the journal Nature.

Researchers are of the opinion that 3D microchip will have more storage capacity by allowing information to be spread across several layers instead of one layer as in the case of traditional chips.

Back in May, 2011, Intel claimed that it has made the new 3D dimensional transistor design. The invention was considered as the most significant in the last 60 years. The company uses miniscule fins attaching to the surface of the flat transistors.

The same year in September IBM and 3M joined hands to develop 3D microchips.

Then in February 2012, scientists from MIT designed Microelectromechanical systems (MEMS) silicon based device with 3D sensing capabilities.

And now, there is another innovative news of 3D microchips. Read More …

Digital devices will come with five senses specific to living things in the next five years: IBM said

5 in 5IBM is fully confident about the invention of digital devices that would be able to see, hear, taste, smell and touch in 5 years as shown by the company’s “5 in 5” list representing the five trends in the next five years.

Instead of brain, the new era of digital devices would rely on “cognitive computing” that would enable the computers and other devices to learn from experience rather than depending on programming so that the device will automatically check for the right option and if there is not a better option the computer will try to generate the best one after checking its history.

“That’s a foundationally different way of thinking of computing,” Bernie Meyerson, IBM’s vice president of innovation, told in an interview to Mashable. “You have to change how you think about absorbing data. You can’t just take a picture and file the picture. You have to treat the picture as an entity at a very high level, as opposed to just a bunch o’ bits.”

“[Cognitive computing] makes for some very interesting shifts in capability,” he adds. “That’s a rather profound sort of driver.” Read More …

IBM’s light fast communication technology between the computer systems

IBM has announced a technology that is said to be a “breakthrough optical communication technology” through which the company has utilized the light instead of electrical signals to send out information from one place to another. This technology has been announced by the company in San Francisco and it is called as “silicon nanophotonics”.

This progress forms a part of IBM’s “Exascale computing program,” which aims to develop a supercomputer that can make a million trillion calculations (a so-called “Exaflop”) per second.

In this technology, IBM has utilized single silicon chip that is made by using standard 90 nanometer manufacturing process and has integrated both the optical components and electrical circuits. This chip has the ability to transmit 25 Gigabits of optical data per second.

Falsely colored blue wires carry optical signals and the yellow wires carry electrical ones (Credit: IBM)

Read More …

“Standing on the shoulders of the giants” and logo psychology of tech companies

One company gives products or services to the other company

Companies rely on each other. One company gives products and services, the other company takes those services. This second company in turn gives products and services, which some other company takes and uses. After searching, you may find that the large companies stand on the shoulders of the other big or small companies. Read More …

IBM and ASTRON are together to explore the far sides of universe

Universe

IBM has announced, on April 2, the five years DOME Project in collaboration with Netherlands Institute for Radio Astronomy (ASTRON) to see through the extreme far reaches of the universe. The project has been named for the protective cover on the telescopes and the Swiss mountain. Read More …

IBM has developed 12 atoms large storage device; World’s smallest magnetic memory

Green bumps represent magnetic atom
12 atoms close together. Green bumps represent magnetic atom.

IBM has developed a new atomic level storage device i.e. made up of 12 iron atoms. The device can retrieve digital 1s and 0s from an array of just 12 atoms.

This research has been done by U.S. and German researchers at IBM and the German Center for Free-Electron Laser Science, and published online in the January 13 issue of the journal Science. Read More …

IBM has acquired Emptoris for increased business to business and consumer experience

IBMThe technology giant International Business Machines Corp. (IBM) has been agreed to acquire Burlington’s Emptoris Inc., a provider of cloud analytics software that helps companies in making supply-chain operations more efficient, in another bid to fill out its mounting catalog of business-to-business and business-to-consumer business. It is the 20th acquisition of the Massachusetts’s company since 2003.

The acquisition started in March 2011. Terms were undisclosed.

Emptoris has 725 employees and 350 customers in 75 countries. Read More …

Novel memory devices by IBM and Micron technologies [Video]

IBM and Micron Technology has announced the production of novel memory cubes i.e. hybrid memory cube (HMC) device with the first commercial CMOS manufacturing technology to make use of through-silicon vias (TSVs) i.e. IBM’s 3D chip-making process.

It has been estimated that advanced TSV-chip making process by IBM will increase the speed of Micron’s HMC up to 15 times as compared to the traditional technologies as it will be the combination of high-performance logic with Micron’s DRAM. Read More …